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Bonding at the push of a button at the Bondexpo 2010: RAMPF showcases bonding technology with induction
RAMPF Giessharze is celebrating a premiere at this year’s Bondexpo. For the very first time, the company is showcasing a one-component polyurethane adhesive at its stand 7501 in Hall 7. Not only is the material highly weather resistant, it also cures at high speeds with the aid of induction. Its bonding at the push of a button. Sister company RAMPF Dosiertechnik is also on hand to present the ideal low-pressure system for material application – complete with integrated induction heating.
RAMPF Group presents new solutions at Electronica and Productronica India
The growth in India identified the IMF these days as a pillar of the global economy. Elated by the forecasts the RAMPF Group is preparing for their performance at the Electronica and Productronica 2010 in Bangalore. The exhibition highlights of RAMPF in the German Pavilion (hall 1, booth 1244): the electrical casting resin RAKU-PUR 21-W41/13-6 which is extremely resistant to thermal shocks and the new compact dispensing system C-DSE.